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DATA SHEET
MOS INTEGRATED CIRCUIT
PD168116A
7-CHANNEL H-BRIDGE DRIVER WITH A MICRO STEP FUNCTION SUPPORTING PULSE INPUT
DESCRIPTION
The PD168116A is a 7-channel H-bridge driver with a micro step function supporting pulse input that consists of a CMOS control circuit and a MOS output stage. It can reduce the current consumption and the voltage loss at the output stage compared with a conventional driver using bipolar transistors, thanks to employment of a MOS process. The PD168116A can drive a stepping motor by inputting pulses, so that the number of signal lines necessary for controlling the motor can be decreased. The package is a 56-pin WQFN that helps reduce the mounting area and height. The PD168116A can be used to drive two stepping motors, or two DC motors and one coil.
FEATURES
* Seven H-bridge circuits employing power MOSFET * Low-voltage driving VDD = 2.7 to 3.6 V VM = 2.7 to 5.5 V * Output on-state resistance: 1.0 TYP., 1.5 MAX. (sum of top and bottom stage, ch1 to ch4, and ch7) 1.5 TYP., 2.0 MAX. (sum of top and bottom stage, ch5 and ch6) * PWM output (ch1 to ch6) , linear output (ch7) * Output current DC current: 0.4 A/ch (when each channel is used independently) Peak current: 0.7 A/ch (when each channel is used independently) DC current: 0.5 A/ch (when used independently) Peak current: 0.7 A/ch (when used independently) * Input logic frequency: 100 kHz supported * Undervoltage lockout circuit Shuts down the internal circuit at VDD = 1.7 V TYP. * Overheat protection circuit Operates at 150C or more and shuts down internal circuitry. * 56-pin WQFN (8 mm, 0.5 mm pitch)
ORDERING INFORMATION
Part Number Package 56-pin plastic WQFN (8 x 8)
PD168116AK9-9B4-A
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.
Document No. S16967EJ1V0DS00 (1st edition) Date Published December 2003 NS CP(K) Printed in Japan
2003
PD168116A
1. PIN CONFIGURATION
Package: 56-pin plastic WQFN (8 x 8)
RESETB PGND34
OUT3B
OUT3A
OUT4B
OUT4A
MOB2
MOB1
SEL7
VM34
VM34
FIL3 30
42 IN7A FIL7 R7 FB7 OUT7A VM7 OUT7B VDD LGND COSC OE1 CLK1 CW1 OE2/IN3A 43 44 45 46 47 48 49 50 51 52 53 54 55 56 1 CLK2/IN3B
41
40
39
38
37
36
35
34
33
32
31
29 28 FIL1 27 FB4 26 FB3 25 FB2 24 FB1 23 OUT1B 22 VM12 21 OUT1A 20 PGND12 19 OUT2B 18 VM12 17 OUT2A 16 IN5A 15 IN5B
2 CW2/IN4A
3 OUT6B
4 OUT6A
5 PGND56
6 OUT5A
7 VM56
8 OUT5B
9 MODE4/IN4B
10 MODE3
11 MODE2
12 MODE1
13 IN6B
14 IN6A
2
Data Sheet S16967EJ1V0DS
FIL2
IN7B
PD168116A
2. PIN FUNCTIONS
(1/2)
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 Pin Name CLK2/IN3B CW2/IN4A OUT6B OUT6A PGND56 OUT5A VM56 OUT5B MODE4/IN4B MODE3 MODE2 MODE1 IN6B IN6A IN5B IN5A OUT2A VM12 OUT2B PGND12 OUT1A VM12 OUT1B FB1 FB2 FB3 FB4 FIL1 FIL2 FIL3 RESETB OUT4A VM34 OUT4B PGND34 OUT3A VM34 OUT3B Function H-bridge 3, H-bridge 4 CLK input pin/H-bridge 3 input pin B H-bridge 3, H-bridge 4 driving direction input pin/H-bridge 4 input pin A H-bridge 6 output pin B H-bridge 6 output pin A H-bridge 5, H-bridge 6 GND pin H-bridge 5 output pin A H-bridge 5, H-bridge 6 power supply pin H-bridge 5 output pin B Mode selection pin 4/H-bridge 4 input pin B Mode selection pin 3 Mode selection pin 2 Mode selection pin 1 H-bridge 6 input pin B H-bridge 6 input pin A H-bridge 5 input pin B H-bridge 5 input pin A H-bridge 2 output pin A H-bridge 1, H-bridge 2 power supply pin H-bridge 2 output pin B H-bridge 1, H-bridge 2 GND pin H-bridge 1 output pin A H-bridge 1, H-bridge 2 power supply pin H-bridge 1 output pin B Current detection resistor connection pin 1 Current detection resistor connection pin 2 Current detection resistor connection pin 3 Current detection resistor connection pin 4 Filter capacitor connection pin 1 Filter capacitor connection pin 2 ch3 reference voltage output pin (Leave this pin open.) Reset pin (low active) H-bridge 4 output pin A H-bridge 3, H-bridge 4 power supply pin H-bridge 4 output pin B H-bridge 3, H-bridge 4 GND pin H-bridge 3 output pin A H-bridge 3, H-bridge 4 power supply pin H-bridge 3 output pin B
Data Sheet S16967EJ1V0DS
3
PD168116A
(2/2)
Pin No. 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 Pin Name MOB1 MOB2 SEL7 IN7B IN7A FIL7 R7 FB7 OUT7A VM7 OUT7B VDD LGND COSC OE1 CLK1 CW1 OE2/IN3A MOB signal output pin 1 (open drain output) MOB signal output pin 2 (open drain output) ch7 excitation mode selection pin H-bridge 7 input pin B H-bridge 7 input pin A Amplifier operation stabilizing filter connection pin Amplifier operation stabilizing resistor connection pin Current detection resistor connection pin 7 H-bridge 7 output pin A H-bridge 7 power supply pin H-bridge 7 output pin B Logic block power supply pin Logic block GND pin Chopping frequency setting capacitor connection pin H-bridge 1, H-bridge 2 output enable pin H-bridge 1, H-bridge 2 CLK input pin H-bridge 1, H-bridge 2 driving direction input pin H-bridge 3, H-bridge 4 output enable pin/H-bridge 3 input pin A Function
4
Data Sheet S16967EJ1V0DS
PD168116A
3. BLOCK DIAGRAM
RESETB VDD MODE3 MOB1 OE2/ CLK2/ CW2/ MODE4/ OE1 CLK1 CW1 MODE1 MODE2 LGND MOB2 IN3A IN3B IN4A IN4B
FB1 FB2 VM12 VM12 OUT1A OUT1B PGND12 FIL1
Current Sense 1 Current Sense 2 Current Sense 4 ch1 H-bridge ch1/ch2 Control ch3/ch4 Control ch3 H-bridge
OSC Current Sense 3
COSC
FB3 FB4 VM34 VM34 OUT3A OUT3B PGND34
OUT2A OUT2B FIL2 VM56 PGND56 OUT5A OUT5B
ch2 H-bridge
Control and Pre-driver ch4 H-bridge
FIL3
OUT4A OUT4B
ch5 H-bridge
TSD ch6 H-bridge UVLO
IN7A IN7B VM7 ch7 H-bridge
IN5A IN5B
IN6A IN6B OUT6AOUT6B SEL7 R7
FIL7
FB7 OUT7A
OUT7B
Data Sheet S16967EJ1V0DS
5
PD168116A
4. STANDARD CONNECTION EXAMPLE
3 to 5 V 100 k x 2 VDD VDD
M
22 F
42
IN7B
41
SEL7
40
MOB2
39
MOB1
38
OUT3B
37
VM34
36
OUT3A
35
PGND34
34
OUT4B
33
VM34
32
OUT4A
31
RESETB
30
FIL3 (open)
29
FIL2
1000 pF x 2
43 IN7A 10 k 150 pF 44 FIL7 45 R7 10 k 46 FB7 1 47 OUT7A 48 VM7 22 F 3 to 5 V 10 F 3 V 49 OUT7B 50 VDD 51 LGND 330 pF (at 100 kHz PWM) 52 COSC 53 OE1 54 CLK1 55 CW1
CLK2/IN3B CW2/IN4A
FIL1 28 FB4 27 FB3 26 FB2 25 FB1 24 OUT1B 23 VM12 22 OUT1A 21 PGND12 20 OUT2B 19 VM12 18 OUT2A 17 IN5A 16 3 to 5 V 22 F 5 k x 4
M
56 OE2/IN3A
MODE4/IN4B
IN5B 15
MODE3 MODE2 MODE1 IN6B IN6A
PGND56
OUT6B
OUT6A
OUT5A
1
2
3
4
5
6
7
OUT5B
VM56
8
9
10
11
12
13
14
M
3 to 5 V
M
22 F
Cautions 1. Be sure to connect all of the pins which have more than one. 2. The constants shown in the above diagram are provided as examples only. Perform design based on thorough evaluation with the actual machine, and change the underlined constants as necessary. 3. A pull-down resistor (50 to 200 k) is connected to the MODE1, MODE2, MODE3, SEL7, OE1, CLK1, CW1, OE2/IN3A, CLK2/IN3B, CW2/IN4A, MODE4/IN4B, IN5A, IN5B, IN6A, IN6B, IN7A, and IN7B pins. Fix these input pins to GND when they are not used.
6
Data Sheet S16967EJ1V0DS
PD168116A
5. SYSTEM APPLICATION DIAGRAM
6 CPU
10 F
100 k x 2 3V
RESETB VDD MODE3 MOB1 OE2/ CLK2/ CW2/ MODE4/ OE1 CLK1 CW1 MODE1 MODE2 LGND MOB2 IN3A IN3B IN4A IN4B
FB1 FB2 5 k x 2 VM12 VM12 OUT1A OUT1B 1000 pF PGND12 FIL1
Current Sense 1 Current Sense 2 Current Sense 4 ch1 H-bridge ch1/ch2 Control ch3/ch4 Control ch3 H-bridge
OSC Current Sense 3
COSC 330 pF FB3 FB4 VM34 VM34 OUT3A OUT3B PGND34 5 k
M
OUT2A OUT2B 1000 pF FIL2 VM56 PGND56
ch2 H-bridge
Control and Pre-driver ch4 H-bridge
FIL3
OUT4A OUT4B
M
ch5 H-bridge
TSD ch6 H-bridge UVLO
IN7A IN7B 3 to 5 V VM7 ch7 H-bridge 22 F
M
OUT5A OUT5B
IN5A IN5B
IN6A IN6B OUT6AOUT6B SEL7 R7
FIL7
FB7 OUT7A
OUT7B
M
10 k 10 k 150 pF 1
Caution The constants shown in the above diagram are provided as examples only. Perform design based on thorough evaluation with the actual machine.
Data Sheet S16967EJ1V0DS
7
PD168116A
6. FUNCTION OPERATION TABLE
6.1 Power Save Function
This IC can be placed in the power-save mode by making MODE1, MODE2, MODE3, and MODE4 high level. This function allows holding of the excitation position when the stepping motor mode is selected and the operation to be started from where the excitation position is held when the power-save mode is cleared. In the power-save mode, the current consumption is reduced to 20 A TYP. because the internal circuits other than UVLO are stopped. In the power-save mode, only input of the RESETB pin is acknowledged, and the other input signals are ignored. The operation modes of ch1 to ch4 can be set by a combination of MODE1 to MODE4. For the combination of the MODE pins, refer to Table 6-1. MODE Pin Truth Table.
Table 6-1. Mode Pin Truth Table
MODE1
MODE2
MODE3
MODE4 (/IN4B) ch1, ch2 2-phase excitation
Operation Mode ch3, ch4 General-purpose driving
L L L L L L L L H
L L L L H H H H L
L L H H L L H H L
IN4B input
1-2 phase excitation
General-purpose driving
Micro step
General-purpose driving
L H L
2-phase excitation 1-2 phase excitation 2-phase excitation (current limiting)
2-phase excitation 1-2 phase excitation 2-phase excitation (current limiting) 1-2 phase excitation (current limiting) Micro step Micro step 2-phase excitation 1-2 phase excitation Micro step
H
L
L
H
1-2 phase excitation (current limiting)
H H H H H H
L L H H H H
H H L L H H
L H L H L H
2-phase excitation 1-2 phase excitation Micro step Micro step Micro step Power save mode
Remark H: High level, L: Low level
8
Data Sheet S16967EJ1V0DS
PD168116A
6.2 ch1, ch2 (Dedicated to Stepping Motor)
RESETB H H H L
CLK1
CW1 L H
OE1 H H L x
Operation Mode Pulse progress, CW mode Pulse progress, CCW mode Output Hi-Z (Internal information is held.) Reset mode (output Hi-Z)
x x
x x
Remark x: High level or low level, Hi-Z: High impedance 6.3 ch3, ch4 (Selecting Stepping Motor, DC Motor and Coil Driving)
RESETB H H H L x x CLK2 CW2 L H x x OE2 H H L x Operation Mode Pulse progress, CW mode Pulse progress, CCW mode Output Hi-Z (Internal information is held.) Reset mode (output Hi-Z)

RESETB H H H H L IN3A/IN4A L L H H x IN3B/IN4B L H L H x H OUT3A/OUT4A Z L
Note
OUT3B/OUT4B Z H
Note
Operation Mode Stop Reverse Forward Brake
L H
H
Reset mode (output Hi-Z)
Note When the PD168116A is used for constant-current driving (when a sense resistor is connected to the FB pin) , PWM chopping driving is performed. Remark Z: Output high impedance
Data Sheet S16967EJ1V0DS
9
PD168116A
6.4 ch5, ch6
RESETB H H H H L
IN5A/IN6A L L H H x
IN5B/IN6B L H L H x
OUT5A/OUT6A Z L H H
OUT5B/OUT6B Z H L H Stop Reverse Forward Brake
Operation Mode
Reset mode (output Hi-Z)
Forward
VM
Reverse
VM
ON
OFF
OFF
ON
LOAD A B A
LOAD B
OFF
ON
ON
OFF
GND
GND
Stop
VM
Brake
VM
OFF
OFF
ON
ON
LOAD A B A
LOAD B
OFF
OFF
OFF
OFF
GND
GND
10
Data Sheet S16967EJ1V0DS
PD168116A
6.5 ch7
RESETB
SEL7
IN7A
IN7B
OUT7A
OUT7B Q1
H-bridge Output State Q2 OFF ON Q3 OFF ON (linear) Q4 OFF OFF
H H
H H
L L
L H
Z L (linear)
Z H
OFF OFF
H
H
H
L
H
L (linear)
ON
OFF
OFF
ON (linear)
H H L
H L x
H
L
H
H
ON
ON
OFF
OFF
Weak excitation operation when SEL7 = H (Function is equivalent.) x x Z Z OFF OFF OFF OFF
VM7
Q1
Q2
OUT7A - + Q3
OUT7B - + Q4
6.6 SEL7 Pin
The current that flows into ch7 can be changed by setting the SEL7 pin.
SEL7 L H
Operation Mode Weak excitation mode (Current 2/3 of the normal setting flows.) Normal operation mode
Data Sheet S16967EJ1V0DS
11
PD168116A
7. COMMAND INPUT TIMING CHART
Figure 7-1. In The Micro Step Mode
RESETB
1
2
3
4
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
CLK
CW
OE
1
2
3
4
5 6 7 8 9 10 11 12 13 14 15 16 17 18 17 16 15 14 13 12 11 10 9
Pulse out (internal)
Chopping pulse
MOB
CW mode Reset state
CCW mode
Output Hi-Z
Reset state
12
Data Sheet S16967EJ1V0DS
PD168116A
Table 7-1. Relationship between Revolution Angle, Phase Current, and Vector Amount (64 micro steps)
Step
Revolution Angle
Phase A - Phase Current
Phase B - Phase Current
Vector Amount
MIN.
TYP. 100 100 98.1 95.7 92.4 88.2 83.1 77.3 70.7 63.4 55.6 47.1 38.3 29.0 19.5 9.8 0
MAX. - 104.5 103.0 100.7 97.4 93.4 88.1 82.3 75.7 68.4 62.6 54.1 45.3 36.1 26.5 17.0 3.8
MIN. - 2.5 12.4 22.1 31.3 40.1 48.6 58.4 65.7 72.3 78.1 83.2 87.4 90.7 93.2 94.5 -
TYP. 0 9.8 19.5 29.0 38.3 47.1 55.6 63.4 70.7 77.3 83.1 88.2 92.4 95.7 98.1 100 100
MAX. 3.8 17.0 26.5 36.1 45.3 54.1 62.6 68.4 75.7 82.3 88.1 93.2 97.4 100.7 103.0 104.5 -
TYP. 100 100.48 100 100.02 100.02 99.99 99.98 99.97 99.98 99.97 99.98 99.99 100.02 100.02 100 100.48 100
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
0 5.625 11.250 16.875 22.500 28.125 33.750 39.375 45 50.625 56.250 61.875 67.500 73.125 78.750 84.375 90
- 94.5 93.2 90.7 87.4 83.2 78.1 72.3 65.7 58.4 48.6 40.1 31.3 22.1 12.4 2.5 -
Caution 0 shows the excitation start position after release of reset. Each value is an ideal value and is not a guarantee value.
Data Sheet S16967EJ1V0DS
13
PD168116A
8. FUNCTIONAL DEPLOYMENT
8.1 Reset Function
An initialization operation is performed and all the internal data is cleared when RESETB = L. The output remains in the Hi-Z state. When RESETB = H, signals can be input. Be sure to perform a reset operation after turning on power supply. When RESETB = L, the internal circuitry is stopped whenever possible, so that the self current consumption can be reduced. When the external input signal is stopped, the current consumption can be lowered to 1 A MAX. Immediately after release of reset, excitation is started from the position where the current of ch1 is 100% and the current of ch2 is 0%, in the micro step drive mode and 1-2 phase excitation drive mode. In the 2-phase excitation drive mode, excitation is started from the position where the currents of ch1 and ch2 are 100%.
8.2 2-phase Excitation Drive Mode and 1-2 Phase Excitation Drive Mode
In the 2-phase excitation drive mode, current of 100% is allowed to flow into ch1 and ch2 simultaneously. In the 12 phase excitation drive mode, the motor can be driven at a higher torque by allowing a current to flow so that the synthesized torque of ch1 and ch2 is the same as the torque at phase 1 position. The 2-phase excitation, 1-2 phase excitation, and micro step driving modes are selected by the MODE1 to MODE4 pins.
Note that 100% (= saturation drive mode) and a mode in which the current set by the sense resistor is used can be selected by the MODE pin. Current control is performed by chopping drive.
8.3 Micro Step Drive Mode of Stepping Motor
The current flowing into the H-bridge is constant by using a vector value so that one period can be stopped in 1/64 steps. This function is provided to realize high-accuracy positioning control of a stepping motor. To realize this micro step driving, the following functions are internally realized by the driver.
* Detection of current flowing into each channel by sense resistor as voltage value * Synthesizing half the dummy sine waveform generated by the internal D/A with PWM oscillation waveform for chopping operation * Driver stage performing PWM drive based on result of comparing detected voltage and synthesized waveform
Because the internal dummy sine wave consists of 64 steps per period, it can be used to drive a stepping motor using 64 divisions. The micro step drive mode, 2-phase excitation drive mode, and 1-2 phase excitation drive mode can be selected by using external pins.
14
Data Sheet S16967EJ1V0DS
PD168116A
Figure 8-1. Concept of Micro Step Drive Operation
+
M
A
8.4 Output Enable (OE) Pin
The OE1 (OE2) pin can be used to forcibly stop pulse output of ch1 and ch2 (or ch3 and ch4) . When OE1 (OE2) = L, the output is forcibly made to go into Hi-Z. Because the internal information is held, however, the motor position information is recorded unless reset is performed. To drive a motor, make sure that OE1 (OE2) = H.
8.5 MOB Output
In the micro step drive mode, L is output from the MOB1 (MOB2) pin when the current of ch1 (ch3) or ch2 (ch4) is 100%. In the 2-phase excitation or 1-2 phase excitation drive mode, L is output when the current of ch1 and ch2 is +100%. By monitoring the MOB output, the excitation position of the stepping motor can be checked. When OE1 (OE2) = L, MOB1 (MOB2) = Hi-Z.
8.6 Current Detection Resistor Connection (FB) Pin
(1) ch1 to ch4 The current detection resistor is connected when current driving is necessary. It is used for micro step driving and solenoid driving. The current that flows into the output is {500 mV (reference voltage) /FB pin resistance x 1000}.
Example)
Where FB = 4.7 k Output current = 500 (mV) /4.7 (k) x 1000 106 (mA) This means constant current driving of about 106 mA.
When current driving is not performed, connect the FB pin to GND.
Data Sheet S16967EJ1V0DS
15
PD168116A
(2) ch7 Connect the current detection circuit between the source of the driver low side and GND. Because the circuit is configured to detect current directly, connect a detection resistor of low resistance (1 maximum) . The current that flows into the output is {200 mV (reference voltage) /FB7 pin resistance} (when SEL7 = H) .
Example)
Where FB7 = 0.5 Output current = 200 (mV) /0.5 () = 400 (mA) This means constant current driving of 400 mA.
Because only ch7 employs the linear drive mode and directly detects the output current, the current accuracy is determined only by the external resistor and the offset of the current control amplifier.
8.7 Undervoltage Lockout (UVLO) Circuit
This function is to forcibly stop the operation of the IC to prevent malfunctioning if VDD drops. When UVLO operates, the IC is in the reset status. If VDD drops abruptly in the order of several s, this function may not operate.
8.8 Overheat Protection (TSD) Circuit
This function is to forcibly stop the operation of the IC to protect it from destruction due to overheating if the chip temperature of the IC rises. The overheat protection circuit operates when the chip temperature rises to 150C or more. When overheat is detected, all the circuits are stopped. When RESETB = L or when UVLO is detected, the overheat protection circuit does not operate.
8.9 Power Up Sequence
This IC has a circuit that prevents current from flowing into the VM pin when VDD = 0 V. Therefore, the current that flows into the VM pin is cut off when VDD = 0 V. Because the VDD pin voltage and VM pin voltage are monitored, a current of 3 A MAX. flows into the VM pin when VDD is applied.
16
Data Sheet S16967EJ1V0DS
PD168116A
9. OPERATION DESCRIPTION
9.1 Output Current Setting The peak value of the output current (100% of the current of ch1 (ch3) or ch2 (ch4) ) is determined by resistor RFB connected to FB1 (FB3) or FB2 (FB4) . This IC has reference power supply VREF (500 mV TYP.) for current comparison, and performs driving with the current obtained from RFB and VREF as the peak output current. Peak output current: IMAX (A) VREF (V) / RFB () x 1000 9.2 Pulse Output The motor is driven by inputting a pulse to the CLK1 (CLK2) pin. The operation advances by one pulse at the rising edge of the CLK1 (CLK2) signal. 9.3 Motor Revolution Direction Setting CLK1 (CLK2) is used to specify the motor revolution direction. In the CW mode, the current of ch2 (ch4) is output, 90 degrees in phase behind the current of ch1 (ch3) . In the CCW mode, the current of ch2 (ch4) is output, 90 degrees in phase ahead of the current of ch1 (ch3) . 9.4 Selecting 2-phase Excitation/Micro Step Drive Mode The 2-phase excitation, 1-2 phase excitation, or micro step drive mode can be selected by using the MODE1 to MODE4 pins. Refer to Table 6-1. Mode Pin Truth Table for details. Immediately after release of reset, the IC is initialized. In the 1-2 phase excitation and micro step drive mode, excitation is started from the position where the output current of ch1 (ch3) is 100% and output current of ch2 (ch4) is 0%. In the 2-phase excitation drive mode, excitation is started from the position where the currents of both ch1 (ch3) and ch2 (ch4) are +100%. When the mode is changed from the micro step driving to the 2-phase excitation (or 1-2 phase excitation) , the position of micro step is held until CLK is input. Pulse output is started by the first CLK input, the position is skipped to the 2-phase position of the next quadrant (or to the closest 1-2 phase position at the rotation direction destination) , and driving is started. Figure 9-1. Concept of Change Operation, Micro Step Driving 2-phase Excitation (1-2 Phase Excitation) .
Microstep stop position (example 1) 2-phase excitation stop position Skipes to the next quadrant
(4)
(1)
Microstep stop position (example 2)
(3)
(2)
Data Sheet S16967EJ1V0DS
17
PD168116A
10. NOTE ON CORRECT USE
10.1 Transmitting Data
Data input when RESETB = L is ignored.
10.2 Pin Processing of Unused Circuit
The input/output pins of an unused circuit must be processed as specified below. A VM power supply pin is provided for each output circuit. The current consumption of the internal circuit can be reduced by dropping the VM power of the unused circuit to GND. However, if there are multiple power supply pins, be sure to connect all of them to the same potential.
Lower OE1, CLK1, and CW1. Open FIL1, FIL2, OUT1A, OUT1B, OUT2A, and OUT2B. Connect FB1 and FB2 to GND.
Set the general-purpose drive mode. Lower OE2/IN3A, CLK2/IN3B, CW2/IN4A, and MODE4/IN4B. Open FIL3, OUT3A, OUT3B, OUT4A, and OUT4B. Connect FB3 and FB4 to GND.
Lower IN5A (IN6A) and IN5B (IN6B) . Open OUT5A (OUT6A) and OUT5B (OUT6B) .
Lower SEL7, IN7A, and IN7B. Open OUT7A and OUT7B. Connect FIL7, FB7, and R7 to GND.
18
Data Sheet S16967EJ1V0DS
PD168116A
11. STEPPING MOTOR DRIVING WAVEFORM
Figure 11-1. 2-phase Excitation Output Mode
Figure 11-2. 1-2 Phase Excitation Output Mode
Phase A current
100%
Phase A current
100%
70% of a current setting 70% of a current setting
-100% 0 1 2 3 4 5 6 7 8
-100% 0 1 2 3 4 5 6 7 8
Phase B current
100%
Phase B current
100%
70% of a current setting 70% of a current setting
-100% 0 1 2 3 4 5 6 7 8
-100% 0 1 2 3 4 5 6 7 8
Remarks 1. Solid line: Output duty 100% drive, Dotted line: Current control drive (The current is in accordance with the current setting.) 2. The horizontal axis of the above charts indicates the number of steps. The above charts show an example in the CW (forward) mode. The current flowing into phases A and B is positive in the direction from OUT pin A to OUT pin B, and negative in the direction from OUT pin B to OUT pin A.
Data Sheet S16967EJ1V0DS
19
PD168116A
Figure 11-3. Micro Step Drive Mode
RESET position
100 99.5 98.1 95.7 92.4 88.2 83.1 77.3 70.7 63.4 55.6 47.1 38.3 29.0 19.5 9.8 0 -9.8 -19.5 -29.0 -38.3 -47.1 -55.6 -63.4 -70.7 -77.3 -83.1 -88.2 -92.4 -98.1 -95.7 -100 -99.5
ch1 current
0
100 99.5 98.1 95.7 92.4 88.2 83.1 77.3 70.7 63.4 55.6 47.1 38.3 29.0 19.5 9.8 0 -9.8 -19.5 -29.0 -38.3 -47.1 -55.6 -63.4 -70.7 -77.3 -83.1 -88.2 -92.4 -98.1 -95.7 -100 -99.5
5
10
15
20
25
30
35
40
45
50
55
60
65
ch2 current
0
5
10
15
20
25
30
35
40
45
50
55
60
65
Remark The horizontal axis of the above charts indicates the number of steps. The above charts show an example in the CW (forward) mode. The current flowing into phases A and B is positive in the direction from OUT pin A to OUT pin B, and negative in the direction from OUT pin B to OUT pin A.
20
Data Sheet S16967EJ1V0DS
PD168116A
12. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25C, glass epoxy board of 100 mm x 100 mm x 1 mm with copper foil area of 15%)
Parameter Power supply voltage Symbol VDD VM Input voltage Output pin voltage DC output current (ch1 to 6ch) DC output current (ch7) Instantaneous output current VIN VOUT ID(DC) ID(DC) ID(pulse) Motor block DC (during output independent operation) DC (during output independent operation) PW < 10 ms, Duty Cycle 20% (during output independent operation) Power consumption Peak junction temperature Storage temperature PT Tch(MAX) Tstg 1.0 150 -55 to +150 W C C Control block Motor block Condition Rating -0.5 to +6.0 -0.5 to +6.0 -0.5 to VDD +0.5 6.2 0.4 0.5 0.7 Unit V V V V A/ch A/ch A/ch
Remark The overheat protection circuit operates at Tch > 150C. When overheat is detected, all the circuits are stopped. The overheat protection circuit does not operate at reset or on detection of ULVO.
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded.
Recommended Operating Conditions (TA = 25C, glass epoxy board of 100 mm x 100 mm x 1 mm with copper foil area of 15%)
Parameter Power supply voltage Symbol VDD VM Input voltage DC output current (ch1 to 6ch) DC output current (ch7) Instantaneous output current VIN ID(DC) ID(DC) ID(pulse) DC (during output independent operation) DC (during output independent operation) PW < 10 ms, Duty Cycle 20% (during output independent operation) Capacitor capacitance MOB pin output sink current Logic input frequency Operating temperature range IMOB fIN TA -10 COSC Open-drain output 330 5 100 75 pF mA kHz C Control block Motor block Condition MIN. 2.7 2.7 0 -0.3 -0.4 -0.6 TYP. MAX. 3.6 5.5 VDD +0.3 +0.4 +0.6 Unit V V V A/ch A/ch A/ch
Data Sheet S16967EJ1V0DS
21
PD168116A
Electrical Characteristics (Unless otherwise specified, TA = 25C, VDD = 3.0 V, VM = 3.0 V)
Parameter VDD pin current in standby mode VDD pin current in during operation High-level input current Low-level input current Input pulldown resistance High-level input voltage Low-level input voltage COSC oscillation frequency H-bridge on-state resistance Symbol IDD(STB) IDD(ACT) IIH IIL RIND VIH VIL fOSC Ron 2.7 V VDD 3.6 V 2.7 V VDD 3.6 V COSC = 330 pF IM = 0.3 A, sum of upper and lower stages (ch1 to ch4, and ch7) Ron56 IM = 0.3 A, sum of upper and lower stages (ch5 and ch6) Output leakage current
Note1
Condition RESETB pin: Low level RESETB pin: High level VIN = VDD VIN = 0 V
MIN.
TYP.
MAX. 1.0 5.0 60
Unit
A
mA
A A
-1.0 50 0.7 x VDD 0.3 x VDD 100 1.0 1.5 200
k V V kHz
1.5
2.0
IM(off) VDDS VREF VREF7
Per VM pin, All control pin: low level 1.7 ch1 to ch4 ch7 IM = 0.1 A, with sense resistor of 2 k, ch1 to ch4 450 180 950 500 200 1050
1.0 2.5 550 220 1150
A
V mV mV
Low-voltage detection voltage Internal reference voltage
Note2
Current detection ratio
Note2
Output turn-on time Output turn-off time
ton toff
RL = 20
0.02 0.02
0.35 0.35
1.0 1.0
s s
Notes 1. This IC has a circuit that prevents current from flowing into the VM pin when VDD = 0 V. 2. The motor current accuracy varies depending on the motor actually used. With this IC, the total of the reference voltage EVRMAX error and the current sense circuit error is within 10%.
22
Data Sheet S16967EJ1V0DS
PD168116A
13. PACKAGE DRAWING
56-PIN PLASTIC WQFN (8x8)
HD D D /2
42 43
HD /2
29 28
4-C0.5 A2
E /2 HE E HE /2
56 1 15 14
A1 DETAIL OF P PART
C
x4 ZE ZD y1 S A S y f SAB b1 b S B
P
c1 c2
(UNIT:mm) ITEM D E f HD HE t DIMENSIONS 7.75 7.75 0.20 8.00 8.00 0.20 0.67 +0.08 -0.04 0.03 +0.02 -0.025 0.64 0.230.05 0.200.03 0.17 0.14-0.16 0.14-0.20 0.50 0.400.10 0.05 0.08 0.10 0.625 0.625 P56K9-50-9B4
TERMINAL SECTION t SAB
x4
A
A A1 A2 b b1 c c1
0.08MIN. 0.08MIN. b x
M
c2
e
Lp SAB
e Lp x y y1 ZD ZE
NOTES 1 "t" AND "f" EXCLUDES MOLD FLASH 2 ALTHOUGH THERE ARE 4 TERMINALS IN THE CORNER PART OF A PACKAGE, THESE TERMINALS ARE NOT DESIGNED FOR INTERCONNECTION, BUT FOR MANUFACTURING PROCESS OF THE PACKAGE, THEREFOR DO NOT INTEND TO SOLDER THESE 4 TERMINALS, SOLDERABLITY OF THE 4 TERMINALS ARE NOT GUARANTEED.
Data Sheet S16967EJ1V0DS
23
PD168116A
14. RECOMMENDED SOLDERING CONDITIONS
The PD168116A should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
PD168116AK9-9B4-A: 56-pin plastic WQFN (8 x 8)
Process Infrared reflow Conditions Package peak temperature: 260C, Time: 60 seconds MAX. (at 220C or higher) , Count: Three times or less, Exposure limit: 3 days
Note
Symbol IR60-103-3
(after that, prebake at 125C for
10 hours) , Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. Products other than in heat-resistant trays (such as those packaged in a magazine, taping, or non-thermal-resistant tray) cannot be baked in their package.
Note After opening the dry pack, store it a 25C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating) .
24
Data Sheet S16967EJ1V0DS
PD168116A
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
Data Sheet S16967EJ1V0DS
25
PD168116A
Reference Documents NEC Semiconductor Device Reliability/Quality Control System (C10983E) Quality Grades On NEC Semiconductor Devices (C11531E)
* The information in this document is current as of December, 2003. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1

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